| 摘要 |
PROBLEM TO BE SOLVED: To prevent a sweeping phenomenon, by maintaining clamp pressures of a top mold and a bottom mold to a PCB strip in the optimum state and increasing moldability, at the time of molding a resin sealing part to the PCB strip having thickness deviation in each region. SOLUTION: A top cavity insert 40 of a top mold 10 is installed, with a height adjusting member 50, putting a specified optimum step-difference upward from a base 11 and the bottom surface of a top center block 30. Thereby clamp pressures to a PCB strip 100 when the top mold 10 and a bottom mold 20 are engaged can be selected most suitablly. The step-difference depends on the thickness of the PCB strip 100. By applying the above optimum clamp pressure, generation of wire sweeping phenomenon like generation of cracks due to deformation of the PCB strip 100 be prevented. Molding failure wherein void or blister is generated in a resin sealing part 105 can be also prevented. |
