Electronic Device with First and Second Contact Pads and Related Methods

摘要

An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.

主权项

1. A semiconductor device comprising:
an integrated circuit; an encapsulating material overlying an upper surface of the integrated circuit; a plurality external contacts disposed at an outer surface of the encapsulating material; wherein each of the external contacts is electrically connected to the integrated circuit; wherein ones of the external contacts are electrically connected to the integrated circuit via wire bonds; and wherein other ones of the external contacts are electrically connected to the integrated circuit via conductive vias without any wire bonds.