发明名称 HIGH-TEMPERATURE SENSOR DEVICE
摘要 PROBLEM TO BE SOLVED: To easily mount and dismantle a sensor device which is connected to a microprocessor through a plurality of wires and measures the exhaust gas of a vehicle. SOLUTION: A plurality of high-temperature metallic thin pieces 34 crimped to cable wiring in advance are rather bent for forming a contact pin section 70 inserted into the passage 74 of an insulating connector insert 72 which forms a connector together with the pin contact section 70. The parts of the thin pieces 34 are bent to have V-shaped cross sections and reinforced so as to prevent the breakage of the pieces 34 in the longitudinal direction when the connector insert 72 is moved forward for receiving a pin section and the front section 110 of the insert passage 4 is tapered so that the pin section 70 may easily pass through the section 110.
申请公布号 JPH10197475(A) 申请公布日期 1998.07.31
申请号 JP19970280498 申请日期 1997.10.14
申请人 ITT MFG ENTERP INC 发明人 STEVEN SOLTAN MUZREY
分类号 G01N27/409;G01N1/22;G01N27/407;H01R13/05;H01R13/432 主分类号 G01N27/409
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