| 摘要 |
<p>PROBLEM TO BE SOLVED: To arbitrarily set an aspect ratio and to machine a base material to be machined in a micron precision level by abutting the base material not having permeability in ultraviolet ray region on a machining base material having permeability in ultraviolet ray region and irradiating the abutting surface thereof with an energy ray containing ultraviolet ray. SOLUTION: A laser beam 4 permeated through a synthetic quartz and reaches the surface 6a of a glass plate 6 almost without attenuating. The laser beam 4 reached the surface 6a is absorbed at an extreme surface to generate abrasion and a machine hole 8 is formed, a scattered matter 9 from the machine hole 8 is scattered, which cuts the surface 5a of the synthetic quartz 5, at the synthetic quartz 5, in which part of the scattered matter 9, a cutting chip and a by product are stuck, abrasion is generated to form a machined hole 7. In this case, the synthetic quartz 5 being the base material to be machined has a permeability. Thus the machining in the depth direction is controlled for the base material to be machined having permeability in a ultraviolet ray region.</p> |
