| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoch-making solventless curable resin compsn., esp. a film-forming compsn., which does not need a special waste-gas treatment apparatus, can be instantly cured, and has high softness and process adhesiveness and to provide a curing method for the same. SOLUTION: This compsn. contains 1-99wt.% oligoester (A) obtd. by reacting 1mol of an acid anhydride (a), about 1mol of an epoxy compd. (b), and 0.01-2mol of a hydroxyl compd. (c) and 99-1wt.% at least one nitrogen-contg. monomer selected from among N-vinylpyrrolidone, N-acryloylmorpholine, N- vinylformamide, and N-vinylcaprolactam. This curing method comprises exposing the compsn. to an electron beam with an acceleration voltage of 30-100kV.</p> |
