发明名称 HEAT INSULATION PANEL FOR HEAT MEDIUM PIPING
摘要 PROBLEM TO BE SOLVED: To make the cost of a heat insulation panel low and facilitate execution of floor heating and the like by providing a plurality of grooves fitting piping for heat medium circulation and having prescribed shape on a panel board composed of foamed styrene and the like respectively. SOLUTION: Two vertical grooves 11, a half-circular arc groove 13 and four quarter-circular arc grooves 14 are formed on one planar side of a panel board 10 formed of foamed styrene and the like with regard to a heat insulation panel 1. The vertical groove 11 is made a parallel straight line of a prescribed interval connected to an opposed horizontal side 10h. The half-circular arc groove 13 is opposed at a prescribed interval as a fixed point on a symmetrical axis 10c is made a symmetrical point, and disposed from an attached position for the vertical groove 11 to a vertical side 10v opposing continuous quarter- circular arc groove 14. Piping for heat medium circulation is fitted to the heat insulation panel 1 disposed on an execution floor, subsequently an aluminum tape and the like are stuck on the whole upper face, finally floor material of a flow ring and the like is attached so as to cover the whole face of the execution floor face. Thereby work execution is made good at a site, and even in the case of an unskilled person, work execution can be easily performed.
申请公布号 JPH10219925(A) 申请公布日期 1998.08.18
申请号 JP19970029011 申请日期 1997.02.13
申请人 YAMATO SHOKAI:KK 发明人 ENDO TOMIHIRO
分类号 E04C2/52;F24D3/16;(IPC1-7):E04C2/52 主分类号 E04C2/52
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