MANUFACTURE OF SEMICONDUCTOR MEMBER AND SEMICONDUCTOR MEMBER

摘要

PROBLEM TO BE SOLVED: To recycle part of a substrate carrying a porous semiconductor layer on its surface as the raw material of a semiconductor member by sticking a film to the semiconductor layer and removing the porous layer from the substrate by applying a force to the film in the direction in which the film can be removed from the substrate. SOLUTION: A porous Si layer 102 is formed on the main surface of a single- crystal Si substrate 101 and a flexible adhesive film 103 is stuck to the surface of the layer 102 or a flexible film is stuck to the surface of the layer 102 with an adhesive. Then the adhesive film 103 is separated form the substrate 101 by applying a force to the film 103 in the direction in which the film 103 can be removed from the substrate 101. Therefore, part of the substrate 101 can be recycled as the raw material of a semiconductor member.