发明名称 HARD CEMENT CHIP BOARD AND ITS PRODUCTION
摘要 <p>PROBLEM TO BE SOLVED: To obtain a hard cement chip board which has high surface smoothness and compactness, has improved water permeation resistance performance at the time of non-coating or coating and has no possibility of the occurrence of warpage by laminating a front layer consisting of a mixture composed of a cement compsn., fine chips of wood and water onto the surface of a base material consisting of a mixture composed of the cement comps. described above, the finely segmented chips of wood and the water and curing this layer. SOLUTION: This hard cement chip board 1 is formed by laminating the front layer 12 consisting of the mixture for forming front layer composed of the cement compsn., the fine chips of wood and water onto the surface of the base material 11 consisting of the mixture formed by mixing the cement compsn., the finely segmented chips of wood and water and curing this layer. In some cases, the hard cement chip board 3 obtd. by laminating the front layers 32 and 33 on both flanks of the base material 31 and curing these layers is formed. The development quantity of the front layer is preferably 1.5 to 5.0kg/m<2> . The cement compsn. preferably contains a thermally cured component consisting essentially of alumina cement, anhydrous gypsum and hemihydrate gypsum and portland cement.</p>
申请公布号 JPH10236864(A) 申请公布日期 1998.09.08
申请号 JP19970010292 申请日期 1997.01.23
申请人 SEKISUI CHEM CO LTD 发明人 KANEKO TAKAAKI;OTA SEIICHI;TAKAHASHI KENJI
分类号 E04F13/14;B28B3/00;B28B3/02;B32B13/04;C04B28/02;C04B28/06;C04B32/02;E04C2/26;(IPC1-7):C04B32/02 主分类号 E04F13/14
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