发明名称 BAND PLATE BENDING APPARATUS
摘要 This invention relates to an apparatus A for bending a band plate (100), such as a band edge, in which a fixed mold (1) having a slit (11) through which the band plate (100) is passed is provided unitarily with a shaft (3), a movable mold (2) for bending the band plate (100) in cooperation with the fixed mold (1) being cylindrically formed, a rotational force being transmitted from an electric motor (5) to one end portion only of the movable mold (2). The shaft (3) is fastened at its lower portion to a machine base (4) with bolts (85) via a mount member (8), whereby the changing of the fixed mold (1) can be done easily. In order to change the fixed mold (1) for another, the bolts (85) are removed, and the shaft (3) is drawn out along with the mount member (8) toward the lower side of the machine base (4), another shaft being inserted from the lower side of the machine base to fix the mount member to the machine base by using the bolts. <IMAGE>
申请公布号 EP0657231(B1) 申请公布日期 1998.09.09
申请号 EP19930913538 申请日期 1993.06.17
申请人 MIZUKAWA, SUEHIRO;OHTANI, SUSUMU;OGAWA, NAOKI 发明人 MIZUKAWA, SUEHIRO;OHTANI, SUSUMU;OGAWA, NAOKI
分类号 B21D5/01;B21D5/04;B21D7/024;B21D37/20;B21D53/64 主分类号 B21D5/01
代理机构 代理人
主权项
地址