| 摘要 |
FIELD: development of three-dimensional electronic equipment. SUBSTANCE: electronic module has chip electronic components, packaged electronic components, and integrated-circuit boards carrying active and passive chip electronic components. Module may incorporate various sensors and transceiver system. Chip electronic components, packaged electronic components, and integrated-circuit boards are electrically interconnected through variable- section flexible corrugated switching boards, in addition to internal connections. Each heat- transfer component is provided with heat sink which is in thermal contact with external flexible shell of module. In addition to all advantages characteristic of three-dimensional modules, and primarily high packing density, proposed design can change its shape: it can compress and expand, bend in any direction without changing its functional properties. EFFECT: improved repairability due to facilitated replacement of any defective component, improved flexibility of module. 11 cl, 12 dwgc |
