发明名称 ADHESIVE, METHOD FOR BONDING, AND ASSEMBLIES OF MOUNTED BOARDS
摘要 <p>A two-part adhesive, characterized by being essentially composed of an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and being separated into agent (A) containing one or two components selected from among an acrylic monomer, a peroxide and a reducing agent and agent (B) containing the other components that have not been selected for agent (A). This adhesive can constantly give a highly reliable bonding which is free from heat stress and excellent in heat resistance.</p>
申请公布号 WO1998051756(P1) 申请公布日期 1998.11.19
申请号 JP1998002082 申请日期 1998.05.11
申请人 发明人
分类号 主分类号
代理机构 代理人
主权项
地址