PASTE OF HEAT-RESISTANT RESIN

摘要

PROBLEM TO BE SOLVED: To obtain the subject paste capable of fast bonding a semiconductor chip to a lead frame by including a specific heat-resistant resin, fine organic particles, specific crosslinking agent and solvent in such a way to secure specific phase conditions before and after drying under heating. SOLUTION: This paste comprises (A) a heat-resistant resin preferably losing its weight by 1% under heating at 350 deg.C or higher, and having hydroxyl, amino or carboxyl group in the molecule, (B) fine organic particles, preferably of heat-resistant resin having an average particle size of 20μm or less, and losing its weight by 1% under heating at 350 deg.C or higher, (C) a crosslinking agent, preferably a coupling agent having a functional group capable of chemically bonding to hydroxyl, amino or carboxyl group, and (D) a solvent, in such a composition that the components A, C and D form a homogeneous phase in which the component B is present as a heterogeneous phase before drying under heating, and a homogeneous phase containing the components A, B and C is formed after drying under heating.