MANUFACTURE OF CHIP COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing chip component wherein outer films can be formed properly. SOLUTION: Recesses 3a being open to the sides of outer films 4 are formed on each of four sides except for the end of each outer electrode film 3, and when an outer paste coated extends by its own liquidity, a part of the outer paste intrudes into the recesses 3a of the outer electrode films 3. Thus when the paste coated becomes thicker than necessary, the excess paste can escape to the recesses 3a of the outer electrode films 3 to stabilize the dimensions of the outer films 4, and the outer films 4 can surely be prevented from bulging and riding on the outer electrode films 3, to properly form the outer films 4 of high quality.