Circuit module and method for producing such a circuit module

摘要

The invention relates to a circuit module (10) having a circuit carrier (12), at least one circuit (14) mounted on the circuit carrier (12), encapsulated by a protective material (16), and at least one electrical/electronic component (18) encapsulated by a protective coating (20), protecting the at least one electrical/electronic component (18) from the protective material (16), and to a method for producing the circuit module (10). According to the invention, the protective coating (20) protecting the at least one electrical/electronic component (18) is only partially encapsulated by the protective material (16).

主权项

1. A circuit module having a circuit carrier (12), at least one circuit (14) which is mounted on the circuit carrier (12) and which is encapsulated by a protective mass (16), and at least one electrical/electronic component (18) which is surrounded by a protective shell (20) which protects at least the at least one electrical/electronic component (18) from the protective mass (16), wherein the protective shell (20) protecting the at least one electrical/electronic component (18) is surrounded by the protective mass (16) only in part, and wherein the protective shell (20) has a pressure equalization device (30) in the form of a diaphragm.