| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inspection support for supporting a semiconductor device when inspecting a semiconductor package element having open backside. SOLUTION: The inspection support 10 comprises a supporting drum 11 for securing a semiconductor device 20 having a mounting surface abutting on the front face of a package drum 23, a cover part 13 comprising a part 14 for opening the backside of a semiconductor chip 21, and a plurality of protrusions 15 touching a plurality of lead 22 and coupled separably with a plurality of leads 22, and connection pins 16 comprising a plurality of internal pins 18 connected electrically with the plurality of lead 22, and a plurality of external pins 19 connected electrically with an external element while penetrating the supporting drum 11. The internal pins 18 of the connection pins 16 has a buffer part 17 for protecting the lead 22 against damage and decreasing contact resistance between the lead 22 and the internal connection pin 18.</p> |
