发明名称 |
FILLER, ITS PREPARATION, RESIN MATERIAL FOR INSULATING LAYER AND MULTI-LAYERED PRINTED-WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a filler which separates from the insulating layer through rough treatment and forms a dent which contributes to the peel strength of the conductor formed on the insulating layer through electroless plating, its preparation method, a resin material for an insulating layer using this filler and a multi-layered printed-wiring board. SOLUTION: A filler comprises an inorganic powder bound with an acrylonitrile-butadiene rubber (NBR) having a functional group in the molecule. This filler is prepared by allowing an inorganic powder, to which an epoxysilane is attached, to react with an NBR having a functional group in the molecule in the presence of a catalyst. This filler is used as a resin material for an insulating layer in electroless plating to compose a multi-layered printed-wiring board. |
申请公布号 |
JPH1192593(A) |
申请公布日期 |
1999.04.06 |
申请号 |
JP19970253940 |
申请日期 |
1997.09.18 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
IRINO TETSURO;TOSAKA YUJI |
分类号 |
C08K9/04;C09C3/10;H05K3/18;H05K3/46;(IPC1-7):C08K9/04 |
主分类号 |
C08K9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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