发明名称 FILLER, ITS PREPARATION, RESIN MATERIAL FOR INSULATING LAYER AND MULTI-LAYERED PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a filler which separates from the insulating layer through rough treatment and forms a dent which contributes to the peel strength of the conductor formed on the insulating layer through electroless plating, its preparation method, a resin material for an insulating layer using this filler and a multi-layered printed-wiring board. SOLUTION: A filler comprises an inorganic powder bound with an acrylonitrile-butadiene rubber (NBR) having a functional group in the molecule. This filler is prepared by allowing an inorganic powder, to which an epoxysilane is attached, to react with an NBR having a functional group in the molecule in the presence of a catalyst. This filler is used as a resin material for an insulating layer in electroless plating to compose a multi-layered printed-wiring board.
申请公布号 JPH1192593(A) 申请公布日期 1999.04.06
申请号 JP19970253940 申请日期 1997.09.18
申请人 HITACHI CHEM CO LTD 发明人 IRINO TETSURO;TOSAKA YUJI
分类号 C08K9/04;C09C3/10;H05K3/18;H05K3/46;(IPC1-7):C08K9/04 主分类号 C08K9/04
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