发明名称 PLATE FOR WIRING ATTACHMENT
摘要 <p>PROBLEM TO BE SOLVED: To arrange a wiring attachment with good appearance in an embedding cavity provided in a building surface. SOLUTION: This plate body 40 of an intermediate plate B to be mounted on the front of a plate frame A is a solidly formed in roughly box shape comprising a main part 41 and a sidewall 42 protruding from the entire circumfernetial edge of the main part 41 to the backside. A metal plate C is mounted on the front of this middle plate B. The width between opposite sidwalls 42 of the plate body 40 is made larger than each width of a plate frame body 1. Specifically, when the middle plate B is mounted on the front side of the plate frame A arranged in a building surface, the plate frame body 1 is stored inside the plate body 40 of the middle plate B and the end edge of the sidewall 42 of the plate body 40 almost makes contact with the building surface. As a result, the fitted part of the plate frame A to the intermediate plate B will not come out forward further than the building surface unlike the case of conventional attachment. This enables improvement of the appearance by making the fitted line of the two parts practically unseen from the side.</p>
申请公布号 JPH11168813(A) 申请公布日期 1999.06.22
申请号 JP19970333326 申请日期 1997.12.03
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KITAZAWA KUNIHIRO;KATO YUTAKA;KITAMURA MASUO
分类号 H02G3/02;H02B;H02B1/00;H02B1/20;H02B1/26;H02G;(IPC1-7):H02G3/02 主分类号 H02G3/02
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