ABRASIVE SLURRY, POLISHING DEVICE FOR SUBSTRATE AND POLISHING METHOD OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To uniform surface height of a built-in wiring by restraining erosion caused in a region where the built-in wirings are crowded and dishing caused in a region where wiring width of the built-in wirings is wide. SOLUTION: After a recessed groove 41 for a narrow wiring and a recessed groove 42 for a wide wiring are formed on an insulated film 31, a barrier layer 32 and a copper film 33 are accumulated on the insulated film 31, and thereafter, the copper film 33 is reflown. Chemical and mechanical polishing is carried out on the copper film 33 while supplying abrasive slurry containing copper ions on an abrasive pad. Thereafter, surface height of the copper film 33 which is accumulated on the recessed groove 41 for the narrow wiring and the recessed groove 42 for the wide wiring and surface height of a protruded part 31a of the insulated film 31 are made roughly equal to each other by forming a copper plated layer 43 on a surface of the copper film 33 by applying negative voltage on the copper film 33 while continuing chemical and mechanical polishing to the copper film 33.