A memory-store component has a rectangular-shaped semiconductor substrate containing active memory-store circuits and bearing, on a large face, output pins (14). This large face is covered with an insulating layer bearing metallic linkage tracks (20) joining, without crossing over, the output pins (14) to connection areas (16) arranged on the said large face along only one of the large sides of the substrate. A memory module can comprise several such components on a patchboard. <IMAGE>
