发明名称 |
Method of making mandrels and circuits therefrom |
摘要 |
The present invention generally includes a process in which a mandrel for semi-additive construction of circuitry is fabricated by laminating shim stock or foil of stainless steel onto a suitable deformable substrate such as a polyimide glass board. Dimples for making raised features on circuitry are formed in the mandrel with a tool. The use of shim stock makes the mandrel relatively light and suitable for automated processing similar to that used to construct circuits on circuit boards.
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申请公布号 |
US5924193(A) |
申请公布日期 |
1999.07.20 |
申请号 |
US19970795259 |
申请日期 |
1997.02.10 |
申请人 |
PACKARD HUGHES INTERCONNECT COMPANY |
发明人 |
CRUMLY, WILLIAM R.;SWARBRICK, DAVID;FEIGENBAUM, HAIM |
分类号 |
H05K3/20;H05K3/40;(IPC1-7):H05K3/02 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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