| 摘要 |
<p>A ball grid array (BGA) semiconductor package includes a paddle, a semiconductor chip on the paddle, a plurality of first leads around a periphery of the paddle, a plurality of second leads attached to a lower surface of each of the first leads, a plurality of conductive wires electrically connecting the semiconductor chip and the first leads, a molding unit sealing the paddle, the semiconductor chip, the first leads, the second leads, and the conductive wires, except for a lower portion of the second leads, and a plurality of solder balls attached to the lower portion of the second leads. A method of fabricating a ball grid array (BGA) semiconductor package having first and second frames includes the steps of attaching a semiconductor chip to a paddle located on the first frame, electrically connecting a plurality of first leads to the semiconductor chip, electrically connecting a plurality of second leads to the plurality of first leads, aligning a first junction unit of the first frame with a second junction unit of the second frame, attaching the first frame to the second frame, molding the first and second frames, and attaching a plurality of solder balls to each of the plurality of second leads.</p> |
