| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a both-side metal-leaf worn laminated plate for a semiconductor plastic package superior in heat radiation and heat-resistance after absorbing humidity. SOLUTION: With a metal plate with both side smooth at a center, a base material reinforcing prepreg resin is allocated on the both surfaces, with one surface thicker by 50-300% than the other surface in resin layer, with the thicker surface allocated on metal side. Furthermore, a metal leaf placed on external side, which is laminated to provide a both-side metal-leaf worn laminated plate for a semiconductor plastic package which is superior in heat-resistance after humidity absorption, heat radiation, etc. Thus, the both-side metal-leaf worn laminated plate for a semiconductor plastic package superior in heat radiation, heat-resistance after humidity absorption, and in mass production is manufactured.</p> |
