Screened integrated circuit packaging and method for the fabrication

摘要

The process uses a standard integrated circuit comprising a protective packaging material such as epoxy resin (5) surrounding the electronic circuitry. A thin metallic or similar conductive layer is applied to the top of the packaging to act as a screen (11). The screen is electrically tied (11a) to one of the circuit connecting pins (6), typically a ground connection on the integrated circuit.