CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE PREPARED BY USING SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive adhesive which is not easily decomposed, does not easily undergo separation during storage, and is excellent in thermal stress relaxation effect. SOLUTION: This adhesive comprises (A) a silicone compd. which has epoxy groups at both the terminals and is prepd. by reacting an organopolysiloxane of the formula (wherein R<1> is a divalent org. group; R<2> and R<3> are each independently H, 1-5C optionally substd. alkyl, phenyl, nuclearly substd. phenyl, optionally substd. alkylene, optionally substd. phenylene, or optionally substd. aralkylene; and n is an integer of 1 or higher) having phenol groups at both the terminals with an epoxy resin, (B) a curing agent, (C) a cure accelerator, and (D) a conductive filler.