| 摘要 |
PROBLEM TO BE SOLVED: To enable stably preferable polishing while maintaining high polishing efficiency by using a polishing solution of an alkaline silica gel composition for the polishing of a semiconductor product surface in a first process, regenerating the polishing solution in a second process, and replacing the regenerated polishing solution with the polishing solution in the first process in a third process. SOLUTION: An alkaline silica gel composition containing low metal is used for surface polishing of the semiconductor product as an alkaline silica gel composition used in the first process. Silica concentration, pH, and a metal content of the used polishing solution generated in the first process is adjusted as a regenerated polishing solution in the second process. Next, a part of the polishing solution in the first process or all thereof is replaced with the regenerated polishing solution obtained in the second process in the third process. Accordingly, the polishing solution is regenerated in the second process according to a batch method, thereby enabling the necessary polishing solution to be repeatedly used in accordance with the desire. The used polishing solution is regenerated without stopping the operation of the system according to a continuous method, thereby enabling efficient polishing. |
