| 发明名称 |
METHOD FOR PRODUCING AN ELECTRONIC CIRCUIT ASSEMBLY |
| 摘要 |
There is disclosed herein a method for producing a wirebonded electronic circuit assembly which obviates the need for soldering aluminum-copper wirebond pads to substrate mounting pads and other copper bonding surfaces. |
| 申请公布号 |
CA2273589(A1) |
申请公布日期 |
1999.12.04 |
| 申请号 |
CA19992273589 |
申请日期 |
1999.06.02 |
| 申请人 |
FORD MOTOR COMPANY OF CANADA LIMITED |
发明人 |
YERDON, TIMOTHY;TOPPING, MARK;PARUCHURI, MOHAN |
| 分类号 |
H01L23/538;H01L25/07;H05K3/24;H05K3/32 |
主分类号 |
H01L23/538 |
| 代理机构 |
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