发明名称 SEMICONDUCTOR PACKAGE AND CASE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To reduce the cost ratio of a molding die to the manufacturing cost by making the outer peripheral edge dimension of an upper mold section to be larger then the outer peripheral dimension of a lower mold section, forming an overhang section around the peripheral edge of the upper mold section, and providing the ends of outer leads connecting respectively to inner leads to the overhang section. SOLUTION: Recesses are formed respectively in the parts corresponding to the molds sealing parts of connecting lead frames of upper and lower molding dies which are used to form the mold sealing parts. In this case, the dimension of opening in the recess of the upper die is made larger than that in the recessed part of the lower die, and an overhang section 3 is formed around the peripheral edge of an upper mold section 1 in the direction of outer periphery of the peripheral edge of a lower mold section 2. An outer lead 4 is exposed over the mold section, and it is formed as to be led out in the direction of outer periphery. Then, when the outer lead 4 is cut along the outer peripheral edge of the upper mold section 1, a connecting terminal remains only in the overhang section 3. An insertion hole matching the dimension of outer periphery of the lower mold section 2 is made on a mounting board B, and they are fitted with the each other.</p>
申请公布号 JPH11345913(A) 申请公布日期 1999.12.14
申请号 JP19980149424 申请日期 1998.05.29
申请人 ROHM CO LTD 发明人 NAKAE KATSUYA
分类号 H01L23/28;H01L23/00;H01L23/12;H01L23/50;(IPC1-7):H01L23/28 主分类号 H01L23/28
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