POLYIMIDE PRECURSOR-CONTAINING RESIN COMPOSITION, AND POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE USING THE SAME AND PATTERN FORMATION OF THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a resin composition useful for e.g. dielectric layers adapted for e.g. fine wiring in electronic devices and capable of providing such a resin as to show a good flatness and the transparency to visible ultraviolet light at the same time besides the heat resistance and mechanical strength inherent in the resin by including a specific polyimide precursor. SOLUTION: This resin composition comprises a polyimide precursor [e.g. comprising respectively 5 to 95 mol.% and 95 to 5 mol.% of the following RU1 and RU2] having a repeating unit (RU1) of formula I (R1 is a bivalent organic group; and (n) is a repeating number) or repeating unit (RU2) of formula II (R2 is R1; R3 is a monovalent organic group; and (m) is (n)). A positive type photosensitive resin composition may be obtained by including a photosensitive substance (e.g. an orthoquinone diazide compound) together with the polyimide precursor.