Interconnection structure and method of forming same

摘要

An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

主权项

1. A bump on trace (BOT) structure, comprising:
an integrated circuit having a contact element; an under bump metallurgy (UBM) feature electrically coupled to the contact element; a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile; and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding, wherein a first width of a distal end of the metal ladder bump is different than a second width of a distal end of the substrate trace, wherein the distal end of the metal ladder bump is relative to the integrated circuit, and wherein the distal end of the substrate trace is relative to the substrate, wherein the integrated circuit is coupled to the substrate trace without use of solder joints.