CHIP-SIZE PACKAGE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide the structure, which can realize the light weight and the thinning of a package. SOLUTION: A recess 11 is formed at the upper surface of a semiconductor chip 10. Bonding pads 20 and insulating pads 30 are formed at the center and the both sides of the bottom surface of the recess 11. The respective pads 20 and 30 are linked by metallic wire 40, and sealing agent 50 is embedded in the recess 11. The intermediate part of the metallic wire 40 is exposed from the sealing part 50. A bump 60 is formed at the part of the exposed metal wire 40. A solder ball 70 is mounted on the bump 60.