发明名称 METHOD AND DEVICE FOR LASER CUTTING
摘要 <p>PROBLEM TO BE SOLVED: To restrain thermal deformation of a material to be cut at the time of laser cutting. SOLUTION: When a laser light 3 is radiated on a surface A of a steel plate 2 for laser cutting the steel plate 2, water 11 for cooling is sprayed in a mist condition around the laser light radiation part of the surface A of the steel plate 2. Thereby, since the periphery of the laser light radiation part of the surface A of the steel plate 2 is cooled by the water 11 sprayed like a mist, temperature distribution of the surface A and an underside B around the laser light radiation part becomes approximately even. Also, the difference between the thermal expansion volume on the surface A side and that of the underside B side of the steel plate 2 is almost eliminated, so that thermal deformation in the plate thickness direction can be restrained.</p>
申请公布号 JP2000052081(A) 申请公布日期 2000.02.22
申请号 JP19980220923 申请日期 1998.08.05
申请人 HITACHI ZOSEN CORP 发明人 KITAGAWA SHOICHI;TAKEDA SHINNOSUKE;IHARA HITOSHI;OSAWA MORIHIKO;YOSHIHARA YASUNORI;FUKUMOTO KAZUHIRO;KAWAI RYOJI;AOKI MASATOSHI;INOUE HIROTSUGU
分类号 B23K31/10;B23K26/00;B23K26/14;B23K26/38;(IPC1-7):B23K26/14 主分类号 B23K31/10
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