发明名称 LASER BEAM MACHINING DEVICE AND METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a laser beam machining device and method by which profiling working such as cutting and welding of a workpiece is carried out precisely by a laser beam by following up the ruggedness and inclination of the workpiece surface while the surface is pressurized. SOLUTION: This device 10 is equipped with a laser beam machining optical system 17 which converges a laser beam L outputted from a laser beam generator 15 and which emits the laser beam to perform machining such as cutting and welding of a workpiece W. The laser beam machining head 11 having this optical system 17 is provided with a fixed unit 12 by which the laser beam is guided, a movable unit with a built-in converging optical system 37, and an elastic holding means 14 installed between the fixed unit 12 and the movable unit. The movable unit comprises a contact type workpiece profiling mechanism which follows up the ruggedness and inclination of the workpiece surface with the elastic holding means 14. By this profiling mechanism, a distance is nearly constantly held from the converging optical system 37 to the workpiece machining position, enabling the profiling working of the workpiece by the laser beam L.</p>
申请公布号 JP2000061669(A) 申请公布日期 2000.02.29
申请号 JP19980241802 申请日期 1998.08.27
申请人 TOSHIBA CORP 发明人 KIMURA SEIICHIRO;YAMADA KIYOSHI;KONO WATARU
分类号 B23K26/00;B23K26/04;B23K26/06;(IPC1-7):B23K26/00 主分类号 B23K26/00
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