发明名称 ANTISTATIC PACKAGING MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To provide an antistatic packaging material formed of a multilayer structure to be easily obtained by holding excellent points of a structure molding made of a thermoplastic resin film, and incorporating sufficient antistatic properties even at a low humidity and high degree of freedoms of a laminated constitution. SOLUTION: The antistatic packaging material comprises a multilayer structure having an organic polymer destaticizing layer containing polyaniline or its derivative and an ionic group-containing copolymer polyester as indispensable components and having a surface resistance measured in a 14% RH atmosphere at 24 deg.C of 1×1010Ω/(square) of less, and two polyester layers made of two types of polyesters different from one another.</p>
申请公布号 JP2000062120(A) 申请公布日期 2000.02.29
申请号 JP19980234113 申请日期 1998.08.20
申请人 TOYOBO CO LTD 发明人 TAKEGAWA YOSHIAKI;ABE KAZUHIRO;KONAGAYA JUJI
分类号 B65D1/00;B32B27/36;B65D1/09;B65D85/86;(IPC1-7):B32B27/36 主分类号 B65D1/00
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