发明名称 |
ANTISTATIC PACKAGING MATERIAL |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an antistatic packaging material formed of a multilayer structure to be easily obtained by holding excellent points of a structure molding made of a thermoplastic resin film, and incorporating sufficient antistatic properties even at a low humidity and high degree of freedoms of a laminated constitution. SOLUTION: The antistatic packaging material comprises a multilayer structure having an organic polymer destaticizing layer containing polyaniline or its derivative and an ionic group-containing copolymer polyester as indispensable components and having a surface resistance measured in a 14% RH atmosphere at 24 deg.C of 1×1010Ω/(square) of less, and two polyester layers made of two types of polyesters different from one another.</p> |
申请公布号 |
JP2000062120(A) |
申请公布日期 |
2000.02.29 |
申请号 |
JP19980234113 |
申请日期 |
1998.08.20 |
申请人 |
TOYOBO CO LTD |
发明人 |
TAKEGAWA YOSHIAKI;ABE KAZUHIRO;KONAGAYA JUJI |
分类号 |
B65D1/00;B32B27/36;B65D1/09;B65D85/86;(IPC1-7):B32B27/36 |
主分类号 |
B65D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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