| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an abrasive slurry supplier for polishing devices that supplies abrasive slurry to the inner circumference of surface plates reliably and thus allows high-speed polishing. SOLUTION: A polishing device has a sun gear 1 and an internal gear 2 surrounding the sun gear 1 arranged coaxially, a carrier 4 having a holding hole 4a in which a polishing object 3 is set and meshing both sun gear 1 and internal gear 2 for revolution round the sun gear 1 and simultaneous rotation, and an upper surface plate 5 and a lower surface plate 6 opposed vertically and rotatably to sandwich the carrier 4 therebetween and having respective polishing surfaces 5a and 6a opposed to polish the polishing object 3. To advantages, a slurry reception part 7 is formed on the top of the lower surface plate 6 above the inside diameter thereof, and slurry supply nozzles 8 are placed above the slurry reception part 7.</p> |
