发明名称 ELECTROLESS METAL DEPOSITION ON TO SILYL HYDRIDE FUNCTIONAL RESIN
摘要 PROBLEM TO BE SOLVED: To obtain a metal film having extremely high resolution by a simple method by applying an electroless plating soln. containing a metal ion on a patterned coating layer containing a silyl hydride functional resin on a base body and depositing a patterned metal film on the base body. SOLUTION: This silyl hydride functional resin is preferably a hydrogen silsesquioxane resin and further, a metal ion is derived from a metal salt. The electroless plating soln. contains one or more kinds of substances selected from a group consisting of a solvent of metal salt, a reducing agent, a base, a complexing agent to dissolve the metal salt, a surfactant, and an additive to control the soln. stability and plating rate of the soln. Preferably, a metal seeding soln. containing the metal ion is applied on a coating layer of the silyl hydride functional resin and the seed metal layer is deposited before the electroless plating soln. is applied. Further, the seed metal layer is heated before the electroless plating soln. is applied.
申请公布号 JP2000073176(A) 申请公布日期 2000.03.07
申请号 JP19990164165 申请日期 1999.06.10
申请人 DOW CORNING CORP 发明人 HARKNESS BRIAN
分类号 C23C16/00;C23C18/16;(IPC1-7):C23C18/16 主分类号 C23C16/00
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