| 摘要 |
PROBLEM TO BE SOLVED: To prevent a short circuiting between a wire and the wiring inside a wire pad by specifying the depth of a cavity, and protecting a circuit with a solder resist at least on an edge or a slope of the cavity. SOLUTION: A pattern is drawn on a rolled copper foil with an etching resist and subjected to cupric chloride etching to form a copper circuit 100, a soldering land 400, and a bonding pad 500 which is a metal base circuit substrate 001. A photosensitized solder resist(SR) is coated on a conductive circuit by a thickness of 30 μm, and then a pattern is formed to form an SR layer 600. Drawing is performed at a depth of 0.7 mm and a drawing angle of 30 deg., to form a die mounting part 900 (18 mm square).Then a plating layer 700 of Ni plating (3 μm) and Au plating (0.5 μm) is formed in electroless plating. Thus, for the SR layer 600, a circuit is coated as far as the lower part of drawing, and the formation of a short circuiting with the wire due to the exposure of the wiring inside an external pad is prevented. |
