发明名称 PROCESSING EQUIPMENT
摘要 PURPOSE: A processing equipment is provided to minimize a thermal influence on a liquid processing unit which is integrated with a heating unit. CONSTITUTION: The processing equipment comprises: a first and a second liquid processing unit(70, 80) for supplying a processing liquid onto a substrate and processing the substrate; a heating unit(30, 50) for heating the substrate to a selected temperature; a cooling unit(20) for cooling the substrate to a selected temperature; a first and a second transfer unit(90, 100) for transferring the substrate. The first transfer unit faces opposite to the second transfer unit with the heating unit disposed between the first and second transfer units. The first liquid processing unit faces opposite to the second liquid processing unit with the second transfer unit disposed therebetween. The first transfer unit can load and unload the substrate with respect to the heating unit and the cooling unit and the second transfer unit can load and unload the substrate with respect to the liquid processing unit and the cooling unit.
申请公布号 KR20000016916(A) 申请公布日期 2000.03.25
申请号 KR19990027673 申请日期 1999.07.09
申请人 TOKYO ELECTRON LIMITED 发明人 MATSUYAMA, YUJI
分类号 H01L21/68;B65G49/07;G03F7/20;H01L21/00;H01L21/027;H01L21/677;(IPC1-7):H01L21/68 主分类号 H01L21/68
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