| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance assembling performance when LEDs are mounted with high density by placing the LEDs in recesses having depth substantially equal to the thickness of the LED on the periphery of pinholes made in the surface of a light shielding plate on the LED side and applying the light guide part of the LED tightly to the pinholes of the light shielding plate. SOLUTION: A substrate 5 for mounting a plurality of LEDs 1-1, 1-2,... is provided with a signal wiring for controlling lighting/unlighting of the LEDs 1-1, 1-2,..., and a light shielding plate 6 for irradiating only a specified region with light emitted from the LEDs 1-1, 1-2,.... Pinholes 7-1, 7-2 are made in the light shielding plate 6 so that the light emitted from the LEDs 1-1, 1-2,... can be taken out only to a specified region. Furthermore, a photosensitive body 8 develops colors depending on the light emitted from the LEDs 1-1, 1-2,... and forms an image by varying the density. The light shielding plate 6 is provided, on the substrate 5 side, with a plurality of recesses into which the LEDs 1-1, 1-2,... are received and positioned in place thus holding the LEDs 1-1, 1-2,... tightly between the light shielding plate 6 and the substrate 5.</p> |
