| 摘要 |
PROBLEM TO BE SOLVED: To eliminate peeling of solder balls from printed board at performing a reflow process for mounting a semiconductor chip on the printed board. SOLUTION: A semiconductor device, which uses a polyimide film 1 carrying a prescribed wiring pattern 2 on its surface as a substrate, is constituted in such a way that a semiconductor chip 4 is put in a device hole 3 made through the film 1, solder balls 11 connected to the prescribed spots of the pattern 2 are arranged in an array-like state, and then a stiffener 7 is stuck to the film 1 so as to secure the planarity of the film 1. The stiffener 7 is constituted of a copper sheet having a thickness A of 0.15-0.30 mm.
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