SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To enable to easily measure output signals from specific terminals of chips by extruding the extremity of a relay lead connected to chips for electric power and integrated circuit chips through metal lines from molded resin for sealing a lead frame part including the chips for electric power and the integrated circuit chips. SOLUTION: Integrated circuit chips 6 such as LVIC and HVIC for controlling electric power chips 4 such as IGBT and FWD for switching a large amount of power are mounted on a lead frame 2a. The lead frame 2a is sealed with molded resin 12. The extremity of relay leads 3a-3f which are electrically connected to the electric power chips 4 through aluminum lines 10 and to the integrated circuit chips 6 through metal lines 8 is extruded from the molded resin 12. Since gate voltage of the IGBT and output signals of the HVIC and the LVIC can be directly measured through the use of the extruded terminals, evaluation of electrical characteristics can be easily performed.