Measuring device

摘要

The semiconductor chip (2) has at least one sensor (6) with an active surface (5) facing towards an aperture (3). The chip has electric contact points (9) coupled by flip-chip links (10) to contacts (11) on the support (4) facing the contact points. The support has conductive tracks (12) coupling the contact elements (13) to the contacts. At least one conductive track carrier (16) has counter contacts (14) on conductive tracks (15), which are coupled to the contact elements. The counter contact are on the rear side of the track carrier, facing the support contact elements and are coupled to the contact elements by flip-chip links (17). An Independent claim is included for a method for manufacturing the device.