| 摘要 |
PROBLEM TO BE SOLVED: To suppress warpages attributable to a laminated structure and based on a residual moment, by setting a difference between a linear expansion coefficient of a support member of an adhesive tape having a specific adhesion and a linear expansion coefficient of a tape carrier body within a specified range. SOLUTION: Lattice-shaped terminals 11, such as a grid array, are passed through a plastic film from the front surface to the back at predetermined intervals, and resin-filling holes 12 are formed in a tape carrier body 1 so that the holes 12 interpose the terminals. An adhesive tape 2 adhered to the back of the tape carrier is designed so that a difference between a linear expansion coefficientαof a support substrate 21 and a linear expansion coefficientβof the body 1 (the linear expansion coefficient of a portion where the terminals are provided) is within±0.1β. Further, it is designed to exhibit a low adhesion not only to the tape carrier but also to a sealing member, so that a 180 deg. peal adhesive strength of an adhesive layer 22 can be kept at 400 gf or lower for a tape width of 20 mm after the layer 22 has been heated during manufacture of a semiconductor device.
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