| 摘要 |
A micro-sensor package (10) is provided that includes a micro-sensor (12) and printed circuit board (PCB) (14), or that includes an array of micro-sensors and PCB (14). The micro-sensor (12) includes a first substrate (16) having opposing front and back surfaces, a sensing element (12) on the front surface of the first substrate (16), and a through-chip via (30, 32) disposed within the first substrate (16) and electrically connected to the sensing element (12). The PCB (14) includes a second substrate (38) to which the back surface of the first substrate (16) is bonded. The second substrate (38) defines a recess (44) within which a bond pad (42) is disposed, and the through- chip via (30, 32) of the micro-sensor (12) is electrically connected to the bond pad (42) of the PCB (14). The micro-sensor package (10) may further include a shim (48) bonded to the PCB (14), and that may surround an outer boundary of the micro-sensor (12) and have approximately the same thickness as the micro-sensor (12). |
