| 摘要 |
<p>PROBLEM TO BE SOLVED: To contrive downsizing by narrowing the interval between output pads. SOLUTION: A first protective film is made in the solid line region A and B of a printing drive integrated circuit chip 10, and the external lead-out regions of output pads 2-1 to 2-n are etched to form openings. Then, the second protective film is made only in the solid line region A or only in the whole of the solid line region A and the side part of the solid line region B. As a result, the interval between the adjacent output pads 2-1 to 2-n can be narrowed, and the downsizing of the chip can be realized.</p> |
