| 摘要 |
<p>A process for the selective dissolution of tin and/or lead- or tin-containing alloys from printed circuit boards, comprises contacting the printed circuit board with a solution comprising Ti(IV) and an acid which forms stable and soluble salt of Ti(III), Ti(IV), Sn(II) and Pb(II), under conditions to effect dissolution of substantially all of the Sn and/or Pb- or Sn-containing alloy therefrom, as Sn(II) and/or Pb(II) and recovering from the solution by electrolytic reduction substantially all of the Sn(II) and/or Pb(II) species as Sn and/or Pb. After the electrolytic reduction step the oxidant metal species is regenerated by oxidation and recycled to the first stage of the process.</p> |
