发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive polyimide precursor composition having high sensitivity and being developable at high resolution with an aqueous alkali solution. SOLUTION: The photosensitive resin composition contains (a) a polyamide acid ester having structural units of the formulae (where each of X1-X3 is a tetravalent organic group, each of Y1-Y3 is a divalent organic group and each of R1 and R2 is photosensitive group having secondary carbon as a bonding site), (b) a compound containing a carbon-carbon double bond which can be polymerized under actinic radiation and (c) a photopolymerization initiator.
申请公布号 JP2000206692(A) 申请公布日期 2000.07.28
申请号 JP19990003445 申请日期 1999.01.08
申请人 ASAHI CHEM IND CO LTD 发明人 KANETANI RYUICHIRO;KATAOKA YASUHIRO
分类号 H01L21/027;C08F2/50;C08F290/14;C08G73/12;G03F7/027;G03F7/037 主分类号 H01L21/027
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