发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive polyimide precursor composition having high sensitivity and being developable at high resolution with an aqueous alkali solution. SOLUTION: The photosensitive resin composition contains (a) a polyamide acid ester having structural units of the formulae (where each of X1-X3 is a tetravalent organic group, each of Y1-Y3 is a divalent organic group and each of R1 and R2 is photosensitive group having secondary carbon as a bonding site), (b) a compound containing a carbon-carbon double bond which can be polymerized under actinic radiation and (c) a photopolymerization initiator. |
申请公布号 |
JP2000206692(A) |
申请公布日期 |
2000.07.28 |
申请号 |
JP19990003445 |
申请日期 |
1999.01.08 |
申请人 |
ASAHI CHEM IND CO LTD |
发明人 |
KANETANI RYUICHIRO;KATAOKA YASUHIRO |
分类号 |
H01L21/027;C08F2/50;C08F290/14;C08G73/12;G03F7/027;G03F7/037 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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