| 摘要 |
PROBLEM TO BE SOLVED: To obtain an alkali-developable composition excellent in resist characteristics such as sensitivity, resolution and the like for a thick film and having a relatively low curing temperature by compounding a terminally half- esterified imide siloxane oligomer precursor, an epoxy group-containing silane compound, an aromatic amino compound, a photo-crosslinkable compound, a photopolymerization initiator and a solvent. SOLUTION: A preferable compounding ratio of ingredients is 0.06-0.25 equivalent of an epoxy group-containing silane compound based on one equivalent of the residual carboxylic acid in a terminally half-esterified imide siloxane oligomer precursor (A); 1.90-2.8 equivalents, in terms of an amino group, of an aromatic amino compound based on one equivalent of the dicarboxylic acid component in excess of the diamine constituting the component A together with the dicarboxylic acid; 10-300 pts.wt., based on 100 pts.wt. of the component A, of a photo-crosslinkable compound; and 0.5-30 pts.wt., based on the same, of a photopolymerization initiator. This composition is excellent in film characteristics such as heat resistance, flexibility and the like, and flattening ability of level differences of a base. |
