| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate the contamination of a substrate due to film cutting by providing a perforation in width direction relative to a film main body which is to be pasted, and peeling a cover film of the film main body which is to be pasted to a substrate along the perforation before the main body is pasted to the substrate. SOLUTION: Related to pasting of a resist film 5 to a substrate 1, firstly a film F is delivered from a roll 3 and a perforation M is formed on the film F by a perforation forming unit 7. A cover film 6 is peeled after the perforation M is formed. Related to the substrate 1 after pasting, the substrates are pulled in the transportation direction or in the direction diagonal to it in the lower stream of a transportation path, so that the film F is cut at such perforation M where tooth length is longer for separation from each other. A base film 4 is peeled from the substrate 1 at use. Thus, no film cutting contaminates the substrate while the film main body is accurately pasted to a base body.</p> |
