| 摘要 |
PROBLEM TO BE SOLVED: To increase a service life of a plating solution, and to reduce the manufacturing cost by adsorbing an additive for a copper plating solution, in particular, a brightener in an article to be plated in advance, and achieving the electroplating in a copper plating bath containing no brightener. SOLUTION: A brightener to be adsorbed in an article to be plated in advance includes bis (3-sulfopropyl) di-sulfide or its 2-sodium salt. Its concentration is 0.001-10 g/l. A polymer component and a leveler component can be added to the brightener. The polymer includes polyvinyl alcohol, and its concentration is preferably 0.01-100 g/l. The leveler includes acetamide, and its concentration is preferably 0.001-10 g/l. Regarding the operational condition, the liquid temperature in a plating bath is preferably 10-60 deg.C, and the current density is preferably 0.1-10 A/dm2. |
