| 摘要 |
PURPOSE:To provide a lead frame wherein the waste of resin is not generated and precise sealing is enabled by fusing and curing uncured resin in an excellent state, and a lead frame capable of forming an excellent thin type semiconductor device wherein warp is not generated. CONSTITUTION:A lead frame is provided with a plurality of inner leads which are radially formed so as to surround a semiconductor chip mounting part and outer leads 13 which are continuously connected with each of the inner leads. In the lead frame, a through hole 20 constituted of the following is formed toward the outside; a gate 20 constituted of a notched part having a specified width at the specified region of a package line PL, and a curl 20b which is continuously connected with the gate 20a and constituted of a circular arc type hole having a circular arc type edge whose diameter is larger than the width. |
